december 2009 doc id 10757 rev 4 1/10 10 stth2r06 high efficiency ultrafast diode features very low conduction losses negligible switching losses low forward and reverse recovery times high junction temperature description the stth2r06 uses st turbo 2 600 v planar pt doping technology. it is specially suited for switching mode base drive and transistor circuits. packaged in axial, sma, smb and smc, this device is intended for use in high frequency inverters, free wheeling and polarity protection. table 1. device summary symbol value i f(av) 2 a v rrm 600 v t j 175 c v f (typ) 1.0 v t rr (typ) 35 ns k a do-41 stth2r06 sma stth2r06a smb stth2r06u smc STTH2R06S www.st.com
characteristics stth2r06 2/10 doc id 10757 rev 4 1 characteristics to evaluate the maximum conduction losses use the following equation: p = 1 x i f(av) + 0.125 i f 2 (rms) table 2. absolute ratings (limiting values) symbol parameter value unit v rrm repetitive peak reverse voltage 600 v i f(rms) forward rms current 7 a i f(av) average forward current = 0.5 do-41 t l = 70 c 2a sma t l = 85 c smb t l = 100 c smc t l = 115 c i fsm surge non repetitive forward current do-41 t p = 10ms sinusoidal 40 a sma / smb / smc 30 t stg storage temperature range -65 to + 175 c t j operating junction temperat ure range -40 to + 175 c table 3. thermal resistance symbol parameter maximum unit r th(j-l) junction to lead do-41 l = 5 mm 35 c/w sma 30 smb 25 smc 20 table 4. static electrical characteristics symbol parameter test cond itions min. typ. max. unit i r (1) 1. pulse test: t p = 5 ms, < 2 % reverse leakage current t j = 25 c v r = v rrm --2 a t j = 150 c - 12 85 v f (2) 2. pulse test: t p = 380 s, < 2 % forward voltage drop t j = 25 c i f = 2 a --1.7 v t j = 150 c - 1.0 1.25
stth2r06 characteristics doc id 10757 rev 4 3/10 table 5. dynamic electrical characteristics symbol parameter test conditions min. typ. max. unit t rr reverse recovery time t j = 25 c i f = 0.5 a, i rr = 0.25 a, i r = 1 a --30 ns i f = 1 a, di f /dt = -50 a/s v r = 30 v -3550 t fr forward recovery time t j = 25 c i f = 2 a, di f /dt = 100 a/s v fr = 1.1 x v fmax --100ns v fp forward recovery voltage - - 10 v figure 1. conduction losses versus average forward current figure 2. forward voltage drop versus forward current figure 3. relative variation of thermal impedance junction to case versus pulse duration figure 4. peak reverse recovery current versus di f /dt (typical values) 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0.0 0.5 1.0 1.5 2.0 2.5 p(w) i (a) f(av) t =tp/t tp = 0.05 = 0.1 = 0.2 = 1 = 0.5 0 1 2 3 4 5 6 7 8 9 10 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00 2.25 2.50 2.75 3.00 i (a) fm v (v) fm t =150c (typical values) j t =25c (maximum values) j t =150c (maximum values) j 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 1.e+03 z/r th(j-a) th(j-a) single pulse t (s) p sma do-41 smc smb sma/smb/smc: s = 1cm cu 2 0 1 2 3 4 5 6 7 8 9 0 50 100 150 200 250 300 350 400 450 500 i (a) rm di /dt(a/s) f i =2 x i f f(av) i=i f f(av) i =0.5 x i f f(av) v =400v t =125c r j
characteristics stth2r06 4/10 doc id 10757 rev 4 figure 5. reverse recovery time versus di f /dt (typical values) figure 6. reverse recovery charges versus di f /dt (typical values) figure 7. relative variations of dynamic parameters versus junction temperature figure 8. transient peak forward voltage versus di f /dt (typical values) figure 9. forward recovery time versus di f /dt (typical values) figure 10. junction capacitance versus reverse voltage applied (typical values) 0 50 100 150 200 250 300 0 50 100 150 200 250 300 350 400 450 500 t (ns) rr di /dt(a/s) f i =2 x i f f(av) i=i f f(av) i =0.5 x i f f(av) v =400v t =125c r j 0 50 100 150 200 250 300 350 400 0 100 200 300 400 500 q (nc) rr i =2 x i f f(av) i =0.5 x i f f(av) di /dt(a/s) f i=i f f(av) v =400v t =125c r j 0 .0 0 .2 0 .4 0 .6 0 .8 1 .0 1 .2 25 50 75 100 12 5 i rm q rr t rr t (c) j i=i reference: t =125c f f(av) j v =400v r 0 5 10 15 20 25 30 0 50 100 150 200 250 v (v) fp di /dt(a/s) f i=i t =125c f f(av) j 0 50 100 150 200 250 300 0 50 100 150 200 250 t (ns) fr di /dt(a/s) f i=i t =125c f f(av) j v =1.1 x v max. fr f 1 10 100 1 10 100 1000 c(pf) v (v) r f=1mhz v =30mv t =25c osc rms j
stth2r06 characteristics doc id 10757 rev 4 5/10 figure 11. thermal resistance junction to ambient versus copper surface under each lead figure 12. thermal resistance versus lead length (do-41) r( c/w) th(j-a) 0 20 40 60 80 100 120 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 sma smb smb s (cm2) cu epoxy fr4, e = 35 m cu 0 20 40 60 80 100 120 5 10152025 r (c/w) th l (mm) lead r th(j-a) r th(j-l)
package information stth2r06 6/10 doc id 10757 rev 4 2 package information epoxy meets ul 94, v0 band indicates cathode bending method (do-41): see application note an1471 in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. table 6. do-41 (plastic) dimensions ref. dimensions millimeters inches min. max. min. max. a 4.07 5.20 0.160 0.205 b 2.04 2.71 0.080 0.107 c25.4 1 d 0.71 0.86 0.028 0.034 table 7. sma dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.094 a2 0.05 0.20 0.002 0.008 b 1.25 1.65 0.049 0.065 c 0.15 0.40 0.006 0.016 d 2.25 2.90 0.089 0.114 e 4.80 5.35 0.189 0.211 e1 3.95 4.60 0.156 0.181 l 0.75 1.50 0.030 0.059 ?d ?b a cc e c l e1 d a1 a2 b
stth2r06 package information doc id 10757 rev 4 7/10 figure 13. footprint (dimensions in mm) figure 14. footprint (dimensions in mm) table 8. smb dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 d 3.30 3.95 0.130 0.156 e 5.10 5.60 0.201 0.220 e1 4.05 4.60 0.159 0.181 l 0.75 1.50 0.030 0.059 2.63 5.43 1.4 1.64 1.4 e c l e1 d a1 a2 b 2.60 5.84 1.62 2.18 1.62
package information stth2r06 8/10 doc id 10757 rev 4 figure 15. footprint, dimensions in mm (inches) table 9. smc dimensions ref. dimensions millimeters inches min. max. min. max. a1 1.90 2.45 0.075 0.096 a2 0.05 0.20 0.002 0.008 b (1) 1. dimensions b and c apply to plated leads 2.90 3.20 0.114 0.126 c (1) 0.15 0.40 0.006 0.016 d 5.55 6.25 0.218 0.246 e 7.75 8.15 0.305 0.321 e1 6.60 7.15 0.260 0.281 e2 4.40 4.70 0.173 0.185 l 0.75 1.50 0.030 0.059 e c l e2 e1 d a1 a2 b 8.19 1.54 5.11 1.54 (0.061) (0.201) (0.322) (0.124) (0.061) 3.14
stth2r06 ordering information doc id 10757 rev 4 9/10 3 ordering information 4 revision history table 10. ordering information order code marking package weight base qty delivery mode stth2r06 stth2r06 do-41 0.34 g 2000 ammopack stth2r06rl stth2r06 do-41 0.34 g 5000 tape and reel stth2r06a r6a sma 0.068 g 5000 tape and reel stth2r06u r6u smb 0.11 g 2500 tape and reel STTH2R06S r62 smc 0.243 g 2500 tape and reel table 11. document revision history date revision changes 07-sep-2004 1 first issue 1-jun-2005 2 smc package addition. 30-sep-2009 3 updated ta b l e 6 package dimensions. 04-dec-2009 4 updated ta b l e 9 package dimensions.
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